Thermal Characterization of an IGBT Power Module with On-Die Temperature Sensors
BIDOUCHE ; AVENAS ; ESSAKILI ; DUPONT
Type de document
COMMUNICATION AVEC ACTES INTERNATIONAL (ACTI)
Langue
anglais
Auteur
BIDOUCHE ; AVENAS ; ESSAKILI ; DUPONT
Résumé / Abstract
Today, ThermoSensitive Electrical Parameters(TSEPs) are being investigated in both academic and industrialworks. Nevertheless, in several cases, the temperature evaluationobtained with TSEPs can be erroneous or inaccurate. It istherefore important to propose tools which are able to evaluatethe accuracy and the robustness of TSEPs in operating conditionsof converters. A solution to carry out this evaluation is to usepower dies including a temperature sensor in their structure.This paper evaluates the possibility of using a commercialIntelligent Power Module (IPM) with embedded sensors in IGBTdies to evaluate TSEPs under DC and switching conditions.