Institut Français des Sciences et Technologies des Transports, de l'Aménagement et des Réseaux

Type de document

COMMUNICATION AVEC ACTES INTERNATIONAL (ACTI)

Langue

anglais

Auteur

AVENAS ; DUPONT ; VAFAEI ; THOLLIN ; CREBIER ; PETIT

Résumé / Abstract

Temperature measurement of semiconductorcomponents is essential, in particular to evaluate performancesand to propose health monitoring of power modules.ThermoSensitive Electrical Parameters (TSEPs) are widely usedto estimate a representative temperature of these components,mainly in non-operating conditions, different from the realenvironment of the latter (offline measurements). Nevertheless,some TSEPs may be adapted to online temperaturemeasurements, in operating conditions of power converters. It ishowever difficult to evaluate the accuracy of those TSEPs. Thispaper presents an instrumented chip dedicated to estimate thetemperature in power electronic modules under functionalconstraints. Thus, it offers a reliable and robust tool fortemperature measurements in power electronic converters.Preliminary results presented in this paper concern thetechnological process of realization and demonstrate the goodfunctioning of this instrumented chip under power dissipationand switching conditions.