Power cycling ageing tests at 200°C of SiC assemblies for high temperature electronics
IBRAHIM ; KHATIR
Type de document
COMMUNICATION AVEC ACTES INTERNATIONAL (ACTI)
Langue
anglais
Auteur
IBRAHIM ; KHATIR
Résumé / Abstract
The reliability of power electronic modules is of utmost importance all the more so since they would be exposed to high ambient temperatures and frequent power cycling. Aging tests at 200°C have been done using power cycling in order to study some packaging materials for high temperature power electronics. Junction temperature swings were performed between 196°C and 245°C and tests have concerned the die attach, wire bond and die metallization materials. Experimental results have shown that AuGe solder material is highly resistant comparatively to a high leaded material. Furthermore, for die top-metal/wire couple, gold material exhibits a better performance compared to Aluminum.
